"Initially available in a 512 Gb capacity, SK Hynix’s new 96-layer 3D TLC NAND memory devices are based on a charge trap flash (CTF) design with a peripheral circuits under cells (PUC) architecture. Officially the company has started referring to these devices as “4D NAND” (as announced back at Flash Memory Summit in August), though the technology is not fundamentally different from current 3D NAND architectures."
So, basically a marketing campaign not based in reality. I know it make seem like a small thing, but whatever happened to good old fashioned honesty? I don't know about anyone else. But there is nothing in all the world more attractive than genuine sincerity to me. Be it in business, friendship, or love.
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Targon - Thursday, November 8, 2018 - link
Will they ever make DDR4 3200CL14 memory, or will that stay out of their reach?ajp_anton - Thursday, November 8, 2018 - link
What does the "4D" mean in the last image?Ryan Smith - Thursday, November 8, 2018 - link
"Initially available in a 512 Gb capacity, SK Hynix’s new 96-layer 3D TLC NAND memory devices are based on a charge trap flash (CTF) design with a peripheral circuits under cells (PUC) architecture. Officially the company has started referring to these devices as “4D NAND” (as announced back at Flash Memory Summit in August), though the technology is not fundamentally different from current 3D NAND architectures."TechnoMagi - Friday, November 9, 2018 - link
So, basically a marketing campaign not based in reality. I know it make seem like a small thing, but whatever happened to good old fashioned honesty? I don't know about anyone else. But there is nothing in all the world more attractive than genuine sincerity to me. Be it in business, friendship, or love.