TSMC Preps Cheaper 4nm N4C Process For 2025, Aiming For 8.5% Cost Reduction
While the bulk of attention on TSMC is aimed at its leading-edge nodes, such as N3E and N2, loads of chips will continue to be made using more mature...
1 by 5 hours ago
TSMC 2nm Update: N2 In 2025, N2P Loses Backside Power, and NanoFlex Brings Optimal Cells
Taiwan Semiconductor Manufacturing Co. provided several important updates about its upcoming process technologies at its North American Technology Symposium 2024. At a high level, TSMC's 2 nm plans remain...
0 by 6 hours ago
TSMC's 1.6nm Technology Announced for Late 2026: A16 with "Super Power Rail" Backside Power
With the arrival of spring comes showers, flowers, and in the technology industry, TSMC's annual technology symposium series. With customers spread all around the world, the Taiwanese pure play...
1 by 7 hours ago
Report: Seagate, Western Digital Hike HDD Prices Amid Surge In Demand
Seagate Technology has reportedly notified its customers abouts its plans to raise prices on new hard drive orders and for demands that exceed prior agreements, echoing a similar move...
7 by yesterday
Seagate: Mozaic 3+ HAMR Hard Drives Can Last Over Seven Years
As Seagate ramps up shipments of its new heat assisted magnetic recording (HAMR)-based Mozaic 3+ hard drive platform, the company is both in the enviable position of shipping the...
12 by yesterday
Samsung Starts Mass Production of 9th Generation V-NAND: 1Tb 3D TLC NAND
Samsung Electronics has started mass production of its 9th generation of V-NAND memory. The first dies based on their latest NAND tech come in a 1 Tb capacity using...
2 by yesterday
JEDEC Extends DDR5 Memory Specification to 8800 MT/s, Adds Anti-Rowhammer Features
When JEDEC released its DDR5 specification (JESD79) back in 2020, the standard setting organization defined precise specs for modules with speed bins of up to 6400 MT/s, while leaving...
14 by 3 days ago
SK Hynix and TSMC Team Up for HBM4 Development
SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The...
5 by 6 days ago
TSMC Posts Q1'24 Results: 3nm Revenue Share Drops Steeply, but HPC Share Rises
Taiwan Semiconductor Manufacturing Co. this week released its financial results for Q1 2024. Due to a rebound in demand for semiconductors, the company garned $18.87 billion in revenue for...
11 by 6 days ago
ASML Patterns First Wafer Using High-NA EUV Tool, Ships Second High-NA Scanner
This week ASML is making two very important announcements related to their progress with high numerical aperature extreme ultraviolet lithography (High-NA EUV). First up, the company's High-NA EUV prototype...
13 by on 4/18/2024
Samsung Unveils 10.7Gbps LPDDR5X Memory - The Fastest Yet
Samsung today has announced that they have developed an even faster generation of LPDDR5X memory that is set to top out at LPDDR5X-10700 speeds. The updated memory is slated...
6 by on 4/17/2024
Samsung To Receive $6.4 Billion Under CHIPS Act to Build $40 Billion Fab in Texas
Samsung Electronics this week was awarded up to $6.4 billion from the U.S. government under the CHIPS and Science Act to build its new fab complex in Taylor, Texas...
5 by on 4/16/2024
Corsair Enters Workstation Memory Market with WS Series XMP/EXPO DDR5 RDIMMs
Corsair has introduced a family of registered memory modules with ECC that are designed for AMD's Ryzen Threadripper 7000 and Intel's Xeon W-2400/3400-series processors. The new Corsair WS DDR5...
9 by on 4/12/2024
Western Digital Previews 4 TB SD Card: World's Highest-Capacity
Western Digital this week is previewing the industry's first 4 TB SD card. The device is being showcased at the NAB trade show for broadcasters and content creators and...
15 by on 4/11/2024
Intel To Discontinue Boxed 13th Gen Core CPUs for Enthusiasts
In an unexpected move, Intel has announced plans to phase out the boxed versions of its enthusiasts-class 13th Generation Core 'Raptor Lake' processors. According to a product change notification...
5 by on 4/10/2024
Report: Impact of Taiwanese Earthquake on DRAM Output to be Negligible in Q2
Following the magnitude 7.2 earthquake that struck Taiwan on April 3, 2024, there was immediate concern over what impact this could have on chip production within the country. Even...
2 by on 4/10/2024
Google Develops In-House Arm 'Axion' CPU for Datacenters
Google was among the first hyperscalers build custom silicon for its services, starting first with tensor processing units (TPUs) for its AI initiatives, and then video transcoding units (VCUs...
15 by on 4/9/2024
TSMC to Receive $6.6B Under US CHIPS Act, Set to Build 2nm Fab in Arizona
TSMC has entered into a preliminary agreement with the U.S. Department of Commerce, securing up to $6.6 billion in direct funding and access to up to $5 billion in...
22 by on 4/8/2024
SK hynix to Build $3.87 Billion Memory Packaging Fab in the U.S. for HBM4 and Beyond
SK hynix this week announced plans to build its advanced memory packaging facility in West Lafayette, Indiana. The move can be considered as a milestone both for the memory...
7 by on 4/5/2024
PCIe 7.0 Draft 0.5 Spec Available: 512 GB/s over PCIe x16 On Track For 2025
PCI-SIG this week released version 0.5 of the PCI-Express 7.0 specification to its members. This is the second draft of the spec and the final call for PCI-SIG members...
17 by on 4/4/2024
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